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Cooling chips with fluid…from the inside

Source: Cnet News

 

The University of Limerick in Ireland, in conjunction with Cork’s Tyndall Institute and other research organizations in the country, is working on a liquid cooling system for inside chip packages. Chip packages are those blue/brown plastic sleeves that surround semiconductors and let them plug into a board. When you look at a chip, you’re really looking at the package.

In this system, a chilling liquid would circulate in silicon channels and absorb heat as it passes over hot spots. A rotating component (pictured) would circulate the liquid so that it could absorb heat, release the heat away from the component, and re-enter the channels.

 

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